ZIDANI Mosbah Université de Biskra

Spoluautoři DENDOUGA F., MESSAOUDI S., BAUDIN T., DERFOUF C., BOULAGROUN A. & HELBERT A.L.

The crucial objective In this research is studied the evolution of deformation texture during drawing of copper wire (ETP-99.26%) destined for the electrical cabling and understand its link with mechanical and electrical properties. We observed that the cold drawing causes a crystallographic anisotropy and elongation of grains along the axis of drawing. The texture is mainly made up of fiber <111>//DN (DN// wire-drawing axis) (majority texture) and of fiber <001>//DN (minority texture). The fiber <001>//DN consists of a reinforcement {001}<110> which is convoluted with the component {001}<120>. Moreover, we observe that the fiber <111> / / DN consists of a principal reinforcement {111} <112> . On the other hand we noted an increase in hardness, mechanical resistance and electrical resistivity of wire drawn with the deformation level by wiredrawing [1-7]. The characterization methods used within the framework of this study in order to identify the microstructure and texture evolution for the deformed wires are : electron back scattering diffraction (EBSD), diffraction by X-ray, optical and electronic microscopy, microhardness, the tensile test and electric resistivity measurement .

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