|MESSAOUDI Salim||University de Biskra|
|Spoluautoři ZIDANI Mosbah, BAUDIN Thierry, DERFOUF Chems Eddine and BOULAGROUN Abdelmalek|
This study is one following previous work realize on the copper wires. In this work we examine the evolution of the microstructure, the texture and the mechanical and electrical proprieties on of the DUCAB (98.33% Cu) copper wires. On the drawn wires, the microstructural analysis showed a microstructure with grains deformed and lengthened parallel to the axis of wiredrawing. After annealing, the microstructure became normal with a new distribution of the grain size, the grain size increased slightly for small and medium deformations and has almost doubled for large deformations (> 80%). Measures of texture carried out by EBSD, revealed the presence of two competitive fibers <111> and <100> to the deformations less than 45% in the drawn wires. Beyond this deformation it is the fibre <111> which becomes majority. On the other hand, in the recristallized wires it is only the fibre <111> which was majority even for the weak deformations. With regard to the mechanical and electrical proprieties, we can say that wiredrawing deteriorates these two proprieties. Indeed, we found the decrease in elongation (% A) of the drawn wire according to the deformation increases. There was also an increase in the strength at break (Rm) and electrical resistivity (). After recrystallization annealing at 260 ° C for 30 minutes, these proprieties were stabilized at values very close to those of the wire machine (the initial state) for all studied deformations.