RÍZEKOVÁ TRNKOVÁ Lýdia Slovak University of Technology in Bratislava

Spoluautoři DRIENOVSKÝ Marián, LOKAJ Ján, OŽVOLD Milan

The Sn-Ag-Cu solders are the most commonly used in industry as lead-free solders. Their usage brings new issues as the higher working temperature that leads to increase of copper contamination during soldering process. Higher amount of Cu in the solders may cause the undesired change of its properties. Solder of the composition of Sn99Ag0.3Cu0.7 were used for the experiment in the basic state and with increased amount of Cu to 0.85, 1.0 and 1.2 wt. %. The paper deals with the influence of changed chemical composition to the selected properties of solder: thermal properties, wettability, spreadability, microhardness and microstructure. The analyses were performed using optical microscopy and microhardness measurement.